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Process Integration Hardware Engineer

Id Job: 316a304

🏠 On-site
💼 Meta
📍 Plymouth, England
2 days ago
💰 50862 – 52979 GBP ANNUAL

Job Description

At Meta, we’re developing the future of AR/VR displays. As a Process Integration Hardware Engineer, your job will be in implementation of a manufacturing process for future AR LED components, taking it from research to production. You will work closely with internal research teams and external partners and vendors. You will help define requirements and deliverables, schedule and track project progress. To be successful, you will eliminate barriers to your team’s success, clearly communicate their work to all stakeholders. Ideal team members are adaptable and resilient, eager to approach unfamiliar problems with curiosity and tenacity, and able to find ways to help our research teams be more efficient. This role is based in our partner location in Plymouth.


Process Integration Hardware Engineer Responsibilities:

  • Implementing Meta’s LED development and manufacturing processes in partner facilities worldwide
  • Implement end-to-end metrology plan for manufacturing processes and devices
  • Building and managing project plans at module and full flow level
  • Carrying out risk assessment and mitigation
  • Working with internal and external partners to specify, install and ramp materials, processes and tools
  • Taking ownership of part of a nascent manufacturing flow and its implementation in a partner’s facility
  • Working with the research team to design and implement experimental work flows and products



Minimum Qualifications:

  • Bachelor's degree in Electrical Engineering, Physics, Chemistry, Materials Science or Nano materials or related subject
  • 5+ years experience in industrial semiconductor process or equipment research & development or manufacturing
  • 3+ years experience in two-three of device architecture, epitaxy, lithography, etch, deposition, CMP, or end-to-end metrology processes
  • 2+ years semiconductor process integration experience in CMOS and III/V hybrid materials



Preferred Qualifications:

  • Process development experience in lithography, etch or film deposition modules
  • Good knowledge of main semiconductor characterization techniques, SEM, TEM, FIB, AFM
  • Proven experience in process control and stability, SPC charts, DOEs, control and spec limits validation
  • Experience in yield improvement with a good knowledge of inline data correlation with electrical and probe data
  • Proven technical leadership ability in cross functional and multi-site situations, ideally involving site to site technology transfer and remote assignment


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